Affilication of Author(s):

哈尔滨工程大学

School Sign:

哈尔滨工程大学

Disigner of the Invention:

严云翔,刘世杰,陈旭东,闫奇,耿涛,王佳斌,金夕人

Patent description:

本发明公开了一种石英微孔板低压腐蚀方法，属于加工工艺领域。当石英微孔板中微孔尺寸小于需求尺寸时，给出一种腐蚀扩孔方法。

Type of Patent:

Invent

State of Patent:

Authorized patents

Application Number:

CN202111500933.3

Authorization number:

CN114163135B

Service Invention or Not:

no

First Author:

孙伟民