Enhanced thermal management of 3D-printed heat sinks with paraffin and low-melting-point alloy for electronic cooling
Release time:2026-08-28
Hits:
- Journal:
- International Communications in Heat and Mass Transfer
- Indexed by:
- Journal paper
- Discipline:
- Engineering
- Document Type:
- J
- Volume:
- 174
- Page Number:
- 110885
- Translation or Not:
- no
- Date of Publication:
- 2026-01-01
- Included Journals:
- SCI