一种针对快堆棒束组件耦合传热模型的多孔介质模拟方法
Release time:2025-12
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- Affilication of Author(s):
- 西安交通大学
- Type of Patent:
- Invent
- State of Patent:
- Authorized patents
- Authorization number:
- CN111027112B
- Service Invention or Not:
- no
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